While HiFi audio, clearer image transmission, ultimate image quality and efficient and complete data calculation and transmission are inseparable from the perfect deployment of high-performance components such as acoustics, camera modules, FPC and cooling modules, the highly integrated design will inevitably cause major manufacturers to focus on heat spreading and EMC problems. XPH Group is committed to research and development of thermal conduction and heat spreading, EMI, shielding buffer, conductive adhesive materials and application solutions to provide reliable guarantee for smooth equipment operation and customer experience.
